Thermal conductivity control devices
US10809747B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method for controlling thermal conductivity between two thermal masses includes thermally contacting a first conduction body with a heat source, thermally contacting a second conduction body with a heat sink, and thermally contacting the second conduction body with the first conduction body by moving the first conduction body between a first position and a second position with a thermal expansion component. The thermal expansion component moves the first conduction body between the first position and the second position at a predetermined temperature and heat is conducted from the heat source to the heat sink through the first and second conduction bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.