Systems and methods for overmolding a card to prevent chip fraud
US10810475B1 · kind B1 · utility
3Cited by
121References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/573
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.