Method for producing a circuit for a chip card module and circuit for a chip card module
US10810477B2 · kind B2 · utility
1Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2019 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jul 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48228
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.