Microstructures and porous geometry modeling
US10810793B2 · kind B2 · utility
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27Claims
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Key dates
| Filing date | Mar 13, 2018 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Mar 13, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods for modeling a 3-dimensional (3D) object, comprising operating at least one hardware processor for, receiving a 3D volumetric model of the object, receiving a 3D model of a tile, paving multiple ones of the tiles in the interior domain of the 3D volumetric model, and providing a 3D filled model of the filled inner volume of the 3D volumetric model are provided. Computer program products and systems for doing same are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.