Molded LED display module and method of making thererof
US10810932B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2018 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Dec 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LED display module contains a substrate, and an array of light emitting devices arranged in rows and columns on a substrate. Each light emitting device has a LED chip electrically connected to contact pads on the substrate, a black resin portion covering around the contact pad, and a transparent resin portion molded around the LED chip and the black resin portion. By forming the black resin portion around each metal pad, the LED display module provides an increased contrast ratio for the display surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.