Patent · US Active

Packaging structure comprising at least one transition forming a contactless interface

US10811373B2 · kind B2 · utility

15Cited by
4References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 5, 2016
Grant dateOct 20, 2020
Priority date
Expiry dateOct 5, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2223/6683
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

A packaging structure (100) having a split-block assembly with a first and a second conducting block section (10A,20A) and at least one transition between a first planar transmission line (2A) and a second transmission line (11A), and one or more input/output ports. The first transmission line (2A) is arranged on a substrate disposed on the first conducting block section (10A) and has a coupling section (3A), a cavity (4A) with a cavity opening in an upper surface of the first conducting block section (10A), and the second transmission line (11A) being in line with the first transmission line (2A) and located on an opposite side of the opening of the cavity (4A).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.