Interconnectable circuit boards adapted for lateral in-plane bending
US10811799B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2019 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Feb 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.