Patent · US Active

Cooling arrangement

US10813239B2 · kind B2 · utility

1Cited by

4References

20Claims

0Family size

Assignee

Mahle International GmbH · DE

Inventors

Matthias Ganz · Stuttgart, DE
Jessica Kansy · Stuttgart, DE
Thomas Kalmbach · Stuttgart, DE
Michael Trebbe · Stuttgart, DE

Key dates

Filing date	Jul 11, 2019
Grant date	Oct 20, 2020
Priority date	—
Expiry date	Jul 11, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20936
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A cooling arrangement may include a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system may be arranged. The dielectric fluid may be in heat-transferring contact with the power electronics system and may cool the power electronics system via a fluid movement. The fluid movement may be provided via acceleration forces acting on the cooling arrangement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.