Chassis heat dissipation structure
US10813246B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Nov 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis heat dissipation structure includes a chassis main body. The chassis main body has a chassis support, a thermal module and at least one heat conduction unit. At least one server mainframe is disposed on the chassis support. The thermal module has at least one heat dissipation unit and multiple fan units. The heat dissipation unit is disposed between the fan units and the server mainframe. The heat conduction unit has at least one first end and a second end. The first end is in contact with a heat generation module of the server mainframe. The second end is in contact with the heat dissipation unit. The heat conduction unit serves to conduct the heat of the heat generation module to the heat dissipation unit. The fan units serve to carry away the heat of the heat dissipation unit to dissipate the heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.