Chassis cooling
US10813253B2 · kind B2 · utility
3Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2017 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jul 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.