Cutting device and related systems and methods
US10813665B1 · kind B1 · utility
0Cited by
12References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2020 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2017/3454
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Systems, apparatus, and methods are described for forming an incision in tissue for receiving a surgical instrument. A cutting device for forming the incision can be reversibly coupleable to an instrument, e.g., a dilator. The instrument may define a lumen configured to receive a wire that extends or is otherwise extendable through a puncture site. The cutting device can include a cutting element configured to be actuated to form the incision such that the incision extends form the puncture site and is sized to receive the instrument.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.