Systems and methods for additive manufacturing flow control devices
US10814430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Aug 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A flow control device for an additive manufacturing system is provided. The flow control device includes a gas supply configured to discharge a gas, a first flow modifier configured to modify at least one flow characteristic of a first portion of the gas, and a second flow modifier configured to cooperate with the first flow modifier to modify the at least on flow characteristic of the first portion of the gas. The second flow modifier is further configured to modify at least one flow characteristic of a second portion of the gas, and the first flow modifier and the second flow modifier are configured to cooperate to direct at least a portion of the first portion and the second portion of the gas towards a melt pool in a plurality of particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.