Patent · US Active

Systems and methods for additive manufacturing flow control devices

US10814430B2 · kind B2 · utility

3Cited by
4References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 9, 2018
Grant dateOct 27, 2020
Priority date
Expiry dateAug 13, 2038

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A flow control device for an additive manufacturing system is provided. The flow control device includes a gas supply configured to discharge a gas, a first flow modifier configured to modify at least one flow characteristic of a first portion of the gas, and a second flow modifier configured to cooperate with the first flow modifier to modify the at least on flow characteristic of the first portion of the gas. The second flow modifier is further configured to modify at least one flow characteristic of a second portion of the gas, and the first flow modifier and the second flow modifier are configured to cooperate to direct at least a portion of the first portion and the second portion of the gas towards a melt pool in a plurality of particles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.