Slurry feed system and method of providing slurry to chemical mechanical planarization station
US10814455B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Jul 27, 2017 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Jan 8, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.