Apparatus and method for active shape control of a micro pick up array

US10814496B2 · kind B2 · utility

Inventors

• Andreas Bibl · Los Altos, US
• Paul Argus Parks · Austin, US
• Stephen P. Bathurst · Lafayette, US
• Jon Williams · Oviedo, US
• John A. Higginson · Santa Clara, US
• Shenshen Zhao · San Jose, US

Key dates

• Filing date: Dec 12, 2017
• Grant date: Oct 27, 2020
• Expiry date: Jul 16, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/683
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.