Butene-1 copolymer tie layer in multilayer film structures having a low seal temperature and improved hot tack
US10814588B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | May 6, 2014 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Sep 11, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/704
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Multilayer film (BOPP) structure containing at least: A) a skin (outer) layer substantially consisting of a crystalline low seal Initiation temperature propylene copolymer; B) a tie layer substantially consisting of a butene-1 copolymer having flexural modulus (MEF) of 75 MPa or less; C) a core layer substantially consisting of one or more polypropylene homopolymers designed for BOPP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.