Composition and molded article
US10815369B2 · kind B2 · utility
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3References
9Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 8, 2017 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Nov 5, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0685
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.