Polyamic acid resin and polyamideimide film
US10815378B2 · kind B2 · utility
10Cited by
1References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Oct 21, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/01
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a polyamic acid resin derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride, and a polyamideimide film including polyamideimide derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.