Pressure sensor

US10816422B2 · kind B2 · utility

Assignee

• InvenSense, Inc. · US

Inventors

• Chung-Hsien Lin · Hsinchu, TW
• Rene Hummel · Baar, CH
• Ulrich Bartsch · Ilsenburg, DE
• Marion Hermersdorf · Rödermark, DE
• Tsung Lin Tang · Hsinchu, TW
• Wang Su · East Patchogue, US
• Chia-Min Lin · Hsinchu, TW

Key dates

• Filing date: Feb 24, 2017
• Grant date: Oct 27, 2020
• Expiry date: Jul 26, 2038

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49904
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.