Backchannel resilience for virtual, augmented, or mixed reality (xR) applications in connectivity-constrained environments
US10817050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2019 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Apr 17, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T19/006
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of systems and methods for backchannel resilience in virtual, augmented, or mixed reality (xR) applications in connectivity-constrained environments are described. In an embodiment, a Head-Mounted Device (HMD) may include a processor and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution by the processor, cause the HMD to: encode each of a plurality of Simultaneous Localization and Mapping (SLAM) landmarks, in part, based upon the SLAM landmark's distance to the HMD; and transmit the encoded SLAM landmarks to an Information Handling System (IHS) coupled to the HMD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.