Printed circuit board, main board, and system and method for monitoring temperature
US10817399B2 · kind B2 · utility
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1References
10Claims
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Assignee
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Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Nov 11, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3055
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A board, a mainboard, and a system and method for monitoring a temperature are provided. The board includes one or more temperature sensors and a connecting finger. The one or more temperature sensors are integrated on the board and are connected to the connecting finger. The connecting finger is plugged with a slot on an external mainboard to connect the board to the mainboard. Each of the one or more temperature sensors is configured to: convert an acquired ambient temperature to a current value, and output the current value to the mainboard in a case that the connecting finger is plugged with the slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.