Image-based overlay metrology and monitoring using through-focus imaging
US10817999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A metrology system includes a controller coupled to a detector to image a sample based on the light captured by an objective lens, where an object plane of the detector with respect to the sample is adjustable. The controller may direct the detector to generate reference images of an overlay target on the sample at multiple object planes including at least a first reference image at a first sample layer and a second reference image at a second sample layer. The controller may further determine a reference overlay between the first layer and the second layer at the overlay target based on the first reference image and the second reference image. The controller may further select a measurement object plane for single-image overlay determination that corresponds to the reference overlay within a selected tolerance. The controller may further determine overlay for additional overlay targets at the measurement plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.