Methods of forming power electronic assemblies using metal inverse opals and cap structures
US10818576B2 · kind B2 · utility
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5References
20Claims
0Family size
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Key dates
| Filing date | Jan 9, 2019 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.