Patent · US Active

Microphone packaging for a portable communication device

US10818577B2 · kind B2 · utility

2Cited by

2References

23Claims

0Family size

Assignee

MOTOROLA SOLUTIONS, INC. · US

Inventors

Andrew P. Miehl · Boca Raton, US
Kathryn A. Johnson · Littleton, US
Deborah A. Gruenhagen · Southwest Ranches, US
Rammone Bartlett · Delray Beach, US
Karl F. Mueller · New York, US
Ido Amit · Boynton Beach, US

Key dates

Filing date	Dec 19, 2018
Grant date	Oct 27, 2020
Priority date	—
Expiry date	Dec 19, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A microphone packaging assembly (100) provides a printed circuit board (pcb) (106) for coupling to a microphone device (102) having a bottom acoustic port (104). The pcb provides an acoustic port opening (108) which aligns with the bottom acoustic port (104) of the microphone device (102). A solder pad pattern (110) is disposed on the pcb (106). The solder pad pattern (110) is configured to provide both electrical connection (114) and an incomplete solder seal (116) having purposeful acoustic leak to the microphone device (102). A conformable coating (126) provides a seal to the purposeful acoustic leak. A single acoustic test can be performed to detect proper environmental protection and acoustic sealing of the packaged assembly (100).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.