Electronic power circuits comprising bus-bars forming heat sinks and integration method
US10818605B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 6, 2017 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BBH, BBL) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB1H, BB2H, BB3H, BB4H; BB1L, BB2L, BB3L) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (MEH, MEL).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.