Semiconductor devices
US10818671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Sep 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/36
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of conductive structures arranged on a substrate and spaced apart from each other in a second direction substantially perpendicular to a first direction, in which each of the plurality of conductive structures extends in the first direction. A plurality of contact structures are arranged between the conductive structures in an alternating arrangement and spaced apart from each other in the first direction. A plurality of insulation structures are arranged in a space between the conductive structures and between the contact structures. A plurality of air spacers are arranged between the alternating arrangement of the plurality of conductive structures and the plurality of contact structures, respectively and spaced apart from each other in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.