Flip-chip light-emitting module
US10818829B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2019 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Feb 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0756
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip light-emitting module includes a main circuit board, a heat dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the heat dissipation substrate and a lens unit disposed in the frame. The frame includes a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive paths are electrically connected to the main circuit board. The light-emitting chip is disposed on a heat dissipation substrate including a top conductive contact and a light-emitting surface on the same side of the light-emitting chip. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected to the at least two second conductive paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.