LED chip with improved bonding strength and LED module using the LED chip
US10818830B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Mar 25, 2020 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Mar 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.