Method of manufacturing an organic light emitting diode display
US10818855B2 · kind B2 · utility
2Cited by
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17Claims
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Key dates
| Filing date | Sep 27, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Feb 12, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing an organic light emitting diode display is provided. The method includes: pasting a backboard to an underside of the flexible substrate by a viscosity-variable adhesive; severing the backboard located in the bended region from the backboard located in the non-bended region; peeling off the backboard located in the bended region; and performing a viscosity enhancement treatment to the viscosity-variable adhesive on the non-bended region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.