OLED encapsulation method and structure
US10818870B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
Abstract
An Organic Light Emitting Diode (OLED) encapsulation method and structure are disclosed. The encapsulation method provides a thin film of lipophilicity in a fill region of an encapsulation cover. The lipophilicity of the thin film may attract the thermally curable fill adhesive of low viscosity, and therefore the fill adhesive in the fill region may spread to the corners of the fill region. After the encapsulation cover and an OLED substrate assembly are joined, the fill adhesive may completely fill up the space surrounded a dam adhesive between the encapsulation cover and the OLED substrate assembly, thereby preventing empty pockets formed at the corners and guaranteeing the encapsulation effect to the OLED device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.