Method of operating a semiconductor image sensor with integrated pixel heating
US10819930B2 · kind B2 · utility
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4References
5Claims
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Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Dec 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
At least one of the pixels of the image sensor is heated using at least one heater, and the temperature of this pixel is thus increased by a larger degree than the temperature of at least a further one of the pixels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.