Printed circuit boards with thick-wall vias
US10820420B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.