Component mounting body manufacturing system and component mounting body manufacturing method
US10821468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Dec 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.