Modular laser processing enclosure and system
US10821552B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2016 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | May 21, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A modular laser processing enclosure includes an enclosure housing defining a laser processing area. The enclosure housing includes a top defining a top laser processing access opening providing access to the laser processing area and at least two sides defining side laser processing access openings providing access to the laser processing area. The side laser processing access openings may be located proximate the top of the enclosure housing. The enclosure may further include at least one plate configured to cover any one of the laser processing access openings. Optionally, at least one laser processing head may be configured to be mounted to any one of the laser processing access openings and/or a least one part handling mechanism may be provided to access the laser processing area through any one of the laser processing access openings for delivering parts to and/or from the laser processing area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.