Method of controlling a temperature of a chemical mechanical polishing process, temperature control, and CMP apparatus including the temperature control
US10821572B2 · kind B2 · utility
1Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 23, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.