Patent · US Active

Packaging with insulative walls having cooling device

US10822154B2 · kind B2 · utility

0Cited by
8References
21Claims
0Family size

Inventor

Key dates

Filing dateMay 18, 2018
Grant dateNov 3, 2020
Priority date—
Expiry dateJan 22, 2039

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF25D3/08
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A packaging may include at least one insulative wall and at least one cooling device embedded into the at least one wall. A method of forming at least one insulative wall of a package may include placing a cooling device into a form, closing the form, injecting a liquid form of an expansive foam, and curing the foam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.