MEMS sensors with selectively adjusted damping of suspension
US10822225B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | Jul 6, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/302
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro-electro-mechanical systems (MEMS) device and method of fabricating the MEMS device are disclosed. The MEMS device comprises a substrate, one or more suspension structures connected to the substrate, one or more metallized layers on the one or more suspension structures, and one or more sense structures connected to the one or more suspension structures. The one or more metallized layers provide selectively adjusted damping of the one or more suspension structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.