Patent · US Active

Metalization of surfaces

US10822702B2 · kind B2 · utility

0Cited by

3References

26Claims

0Family size

Assignee

CUPTRONIC TECHNOLOGY LTD. · CY

Inventors

Björn Atthoff · Uppsala, SE
Sven Göthe · Bromma, SE

Key dates

Filing date	Oct 28, 2016
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Oct 28, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/387
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for application of a metal on a substrate comprises a) contacting at least a part of the surface of the substrate with at least one initiator, and polymerizable units with the ability to undergo a chemical reaction to form a polymer, the polymer comprising at least one charged group, wherein the contacting is achieved by contacting a pad with a plate comprising the at least one initiator and the polymerizable units and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one initiator and the polymerizable units to the surface of the substrate. Subsequently a metal layer is produced on the surface. The compactness of the applied metal layer is increased.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.