Thermal barrier system with bond coat barrier
US10822966B2 · kind B2 · utility
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38References
15Claims
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Assignee
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Key dates
| Filing date | May 9, 2016 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Sep 24, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating system disposed on a surface of a substrate is provided. The coating system includes a bond coating on the surface of the substrate, a protective coating on the bond coating, a thermal barrier coating on the protective coating, and a protective agent disposed within at least some of the voids of the thermal barrier coating. The protective coating is constructed from a ceramic material, and the thermal barrier coating defines a plurality of elongated surface-connected voids. Methods are also generally provided for forming such a coating system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.