Patent · US Active

Pressure equalized lighting subassembly

US10823388B2 · kind B2 · utility

0Cited by
10References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 7, 2019
Grant dateNov 3, 2020
Priority date
Expiry dateMar 7, 2039

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF21Y2115/10
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Provided is a lighting subassembly that includes a printed circuit board having one or more lighting elements thereon and a single through-hole at a center region thereof for air flow, a lens to cover the one or more lighting elements, and an overmold body covering the lighting assembly. The overmold body secures the lens in place and covers a back surface of the printed circuit board opposite the one or more lighting elements and includes a plurality of through-holes corresponding to the through-hole of the printed circuit board. A vent is also included in the lighting subassembly and is disposed adjacent to the through-hole of the printed circuit board in between the overmold body and the printed circuit board, configured to only allow air to flow therethrough such that the through-holes and the vent together create a venting system to allow airflow through the lighting subassembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.