Method and apparatus to measure strains in adhesives of joints
US10823655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0296
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Joints, strain measurement systems to measure strains in one or more components of joints, and methods of determining fatigue lives of joints are disclosed herein. A joint includes a first component, a second component, an adhesive, and a strain measurement system. The adhesive couples the first component and the second component together. The strain measurement system is configured to measure strain in one or more components of the joint. The strain measurement system includes a sensor coupled to one of the first component and the second component and a controller coupled to the sensor. The controller includes a processor and memory coupled to the processor that has instructions stored therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.