Heat transfer through frame component of head-mounted device
US10823969B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Dec 14, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a frame component of a head-mounted device (HMD) configured to secure the HMD to a head of a user. The frame component includes therein a first compartment, a second compartment, and a channel connecting the first compartment and the second compartment. The frame component is configured to be positioned along a side of the head with the channel passing over an ear of the head, the first compartment disposed on a first side of the ear, and the second compartment disposed on a second side of the ear. The apparatus also includes a battery disposed within the first compartment, a processor disposed within the second compartment, and a heat pipe extending from the first compartment to the second compartment through the channel. The heat pipe is configured to transfer heat from the processor to the battery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.