Patent · US Active

Heat sinking enclosure for disk array

US10825483B2 · kind B2 · utility

0Cited by

5References

13Claims

0Family size

Assignee

Dell Products L.P. · US

Inventors

Haifang Zhai · Shanghai, CN
Hendry Xiaoping Wu · Shanghai, CN
David Dong · Shanghai, CN
Yujie Zhou · Shanghai, CN

Key dates

Filing date	Jan 9, 2019
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Jan 9, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20736
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.