Machine learning on wafer defect review
US10825650B2 · kind B2 · utility
4Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jun 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.