Patent · US Active

Baking device for a wafer coated with a coating containing a solvent

US10825701B2 · kind B2 · utility

1Cited by

7References

14Claims

0Family size

Assignee

SUSS MICROTEC LITHOGRAPHY GMBH · DE

Inventors

Gregory George · Colchester, US
Aaron Foley · Campbell, US
Oliver Treichel · Stuttgart, DE

Key dates

Filing date	Nov 23, 2015
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Sep 27, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6719
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A baking device for a wafer coated with a coating containing a solvent is described, having a baking chamber, a support for the wafer, an inlet for a purge gas, and an evacuation for the purge gas charged with solvent evaporated from the coating. The inlet is formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer, and the evacuation is formed as an evacuation ring which radially surrounds the diffusion element and is arranged at a ceiling of the baking chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.