Single-sided light-emitting LED chips and fabrication method thereof
US10825960B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 10, 2019 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
Abstract
Provided are a single-sided light-emitting LED chip and a fabrication method thereof. The single-sided light-emitting LED chip includes a highly reflective dielectric film and an LED including a substrate layer, an epitaxial layer, a cathode, and an anode. The LED has a substrate side, that is one surface of the substrate layer, and an electrode side opposite to each other, and the four sidewalls that respectively contacts the substrate side and the electrode side. The epitaxial layer is located on the other surface of the substrate layer; the cathode and the anode are located on a side of the epitaxial layer away from the substrate layer; and the four sidewalls of the LED are covered with the highly reflective dielectric film. The present invention simplifies the packaging process and improves the luminous efficiency of the packaged chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.