Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
US10825967B2 · kind B2 · utility
2Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
Abstract
A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.