Apparatus and method for RF isolation in a packaged integrated circuit

US10826195B2 · kind B2 · utility

Assignee

• Anokiwave, Inc. · US

Inventors

• Kristian N. Madsen · Napa, US
• Vipul Jain · Irvine, US
• Amir Esmaili · San Diego, US
• Chad Cookinham · San Diego, US
• Noyan Kinayman · Malden, US
• Shamsun Nahar · San Diego, US
• David W. Corman · Gilbert, US
• Nitin Jain · San Diego, US

Key dates

• Filing date: Mar 28, 2018
• Grant date: Nov 3, 2020
• Expiry date: Aug 25, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an “RF group”) and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.