Printed circuit substrate
US10827603B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Dec 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit substrate includes a circuit unit, a first main frame ground interconnection, a first sub frame ground interconnection spaced away from the first main frame ground interconnection in a first direction, and a first conductive via connecting the first main frame ground interconnection and the first sub frame ground interconnection to each other. In plan view from the first direction, a second outer periphery of the first sub frame ground interconnection is surrounded by a first outer periphery of the first main frame ground interconnection. Thus, a printed circuit substrate that can prevent the circuit unit from malfunctioning can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.