Lens module having photosensitive chip embedded in through hole of circuit board and assembly method thereof
US10827606B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.