Mounting structure
US10827616B2 · kind B2 · utility
0Cited by
0References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2019 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.